01 The Revolutionary 5G Pre-Module
[ShangHai, China, February 25, 2020] Built on a 5G modem chipset, the 5G pre-module is open and broadly compatible as well as having multiple interfaces. It simplifies module development, meets common industry needs, and reduces the time and resources customers need to invest when developing 5G applications, thereby enabling the commercial use of 5G across all industries.
One-Stop Module Solution from Baseband to RF
The 5G pre-module is not just a baseband chipset, but a one-stop 5G module solution. It integrates baseband, RF transceiver, low noise amplifier (LNA), and power management unit (PMU) chipsets, and provides commercially verified design references. By saving module developers from convoluted tasks such as RF component matching, it substantially reduces the time and hassle required for development.
All-RAT, All-Band Communications and Super Uplink
If a 5G module is to be applied in scenarios like smart manufacturing, video, commercial displays, and V2X, it must be able to achieve high uplink rates and low latency, and adapt to extreme temperatures.
HiSilicon's 5G pre-module has a number of impressive features: It supports both non-standalone (NSA) and standalone (SA) architectures, all RAT connections from 2G to 5G, and all frequency bands from millimeter wave to sub-6 GHz. It offers industry-leading 5G peak rates: downlink 4.6 Gbit/s and uplink 2.5 Gbit/s on sub-6 GHz frequency, and downlink 6.5 Gbit/s (7.5 Gbit/s when 5G and LTE connections are both used) and uplink 3.5 Gbit/s on millimeter wave. It is the first to support 5G Super Uplink, which improves uplink rates, extends coverage, and greatly reduces latency, thereby meeting the communication requirements of various industry scenarios.
Open Capabilities Enable 5G Modules for All Industry Scenarios
For devices in all industries, modules are the key to 5G access, but requirements vary by scenario. For example, data transmission security is the main concern for those in the industrial sector, while remote management is vital for massive IoT devices in smart cities.
HiSilicon's 5G pre-module has diverse open capabilities which help module vendors to develop modules according to their own requirements. It has a powerful dual-core application processor (AP) with computing power of up to 14400 DMIPS. This means it can enable applications for diverse industries with its OpenCPU solution while reducing the cost of devices. In addition, the open software development kit (SDK) and complete toolchain support a wide range of network protocol stacks, IoT protocol stacks, security protocol stacks, and remote upgrade frameworks, which enable the development and adaptation of modules for different industries.
In future, more modules will be launched based on the open capabilities of HiSilicon's 5G pre-module, to meet the needs of all industry scenarios.
02 5G+X Solution Enables Scenario-Based Applications
HiSilicon draws on many years of experience in HD audio/video and AI computing, as well as industry-leading 5G capabilities, to provide its 5G+X solution for module and device customers. This solution reduces costs and shortens the time to market (TTM). It integrates HiSilicon-developed camera, set-top box (STB), and TV chipsets with the 5G pre-module, and opens capabilities through component sharing, joint driver design, and overall solution optimization.
5G+ Industrial Applications: Redefining 5G Industrial Modules
With its all-weather, 24/7 capabilities and excellent security mechanism, the 5G pre-module helps industry partners build powerful industrial modules.
All chipsets integrated in the 5G pre-module, from baseband to the RF system, are rigorously tested and filtered to meet extreme environment requirements, from –40°C to +85°C. A microkernel ensures the systematic security of the working environment, protecting data, securing interfaces, and implementing system authentication and authorization, as well as security isolation.
5G+4K/8K Solution: Speeding up UHD Content Production and Enhancing the Viewing Experience
Combining high-bandwidth 5G with ultra-HD (UHD) technology (4K, 8K, and VR) will drive revolutionary changes to the capturing, encoding, playback, and transmission of video content:
For large events, such as performances and sports matches, HD video can be captured, encoded, and transmitted through the 5G network.
For commercial displays, large screens, and household 4K/8K TVs, HD signals can be received and videos can be played through the 5G network.
Uplink and downlink data transmission is available for media, videoconferencing, video surveillance, and vehicle-mounted displays.
Because of the 5G pre-module's open capabilities, HiSilicon's 5G+4K/8K chipset solution helps customers launch 5G cameras, STBs, and TVs within a shorter time frame and at lower cost:
Costs reduced by 20%：Shares memory, clocks, and power components to reduce costs, and implements partial functions by using the 5G pre-module's AP, improving systematic performance
Higher performance：Improves data throughput, reduces image jitter, and improves image quality by identifying specific fields
Shorter TTM：Provides a verified driver interconnection software to implement one-stop authentication (plug-and-play) after the camera/TV/STB chipsets and the 5G pre-module have been interconnected and commissioned, shortening TTM by at least 3 months
5G+V2X Solution: Empowering Smart Transportation
5G+V2XHiSilicon's 5G+V2X solution builds a system that implements real-time interaction between vehicles, roads, pedestrians, and the cloud. This ensures that traffic runs efficiently and securely, and accelerates the implementation of advanced driver assistance systems (ADAS).
With its embedded V2X function, the 5G pre-module can be applied to a wide range of scenarios. It can be installed in road auxiliary devices, including road signal lights and electronic signs, and supports the interconnection of road sensors and display units, such as cameras, traffic meteorological stations, roadside radars, signal lights, variable message signs (VMSs), raised pavement markers, and digital triangular cones. By interacting with vehicles and traffic command centers in real time, it can integrate multiple types of sensory data, and provide traffic participants with comprehensive digital information about road conditions.
Some functions of the FEM are provided by third-party components.