Hi3519AV100 chip

• Dual-core Arm Cortex-A53@1.5 GHz, 32 KB I-cache, 32 KB D-cache, 256 KB L2 cache
• Neon acceleration, with an integrated FPU

• Integrated Tensilica Vision P6 DSP@710 MHz
• 32 KB I-cache, 32 KB IRAM, and 512 KB DRAM
• 0.3 TOPS neural network computing performance
• HUAWEI LiteOS

• Multiple neural network options, such as AlexNet, VGG, ResNet, and GoogLeNet
• Multiple neural network options for object detection, such as the Faster R-CNN, SSD, and YOLOv2
• 1.7 TOPS neural network computing performance
• Comprehensive APIs and toolchains (compilers and simulators) to adapt to customized networks

• H.265 Main Profile, Level 5.1
• H.264 Baseline/Main/High Profile, Level 5.1
• I-/P-/B-slice supported for H.264/H.265 encoding and decoding
• JPEG Baseline
• Maximum resolution for H.264/H.265 encoding and decoding: 8192 x 8192
• H.265/H.264 encoding and decoding performance:
− 3840 x 2160@60 fps + 720p@30 fps encoding
− 3840 x 2160@60 fps decoding
− 3840 x 2160@30 fps encoding+3840 x 2160@30 fps decoding
• Maximum resolution for JPEG encoding and decoding: 8192 x 8192
• Maximum JPEG encoding and decoding performance: 16 MP (4608 x 3456)@30 fps
• Multiple bit rate control modes, such as CBR, VBR, AVBR, FIXQP, and QPMAP
• Up to a bit rate of 120 Mbit/s for H.265 encoding outputs and 200 Mbit/s for H.264 encoding outputs
• Encoding of up to eight ROIs

• 12-lane image sensor serial inputs, as well as MIPI, sub-LVDS, HiSPI, and SLVS-EC interfaces
• Up to 5-channel sensor serial inputs and multiple combination modes: 12 lanes, 8 lanes + 4 lanes, or 4 lanes + 4 x 2 lanes
• Maximum input resolution: 7680 x 8192
• 10-/12-/14-bit Bayer RGB DC timing VI
• BT.656 and BT.1120 VI
1–channel to 4-channel YUV inputs through the MIPI virtual channels
• ISP and Image Processing
• Multi-channel TDM to process multi-sensor video inputs
• Adjustable 3A functions (AE, AWB, and AF)
• FPN removal
• 2-frame WDR exposure, local tone mapping, strong light suppression, and backlight compensation
• Defect pixel correction (DPC) and lens shading correction (LSC)
• Multi-level 3DNR, which removes motion smearing and chroma noise and provides excellent image effects in low illumination
• 3D-LUT color adjustment
• Image dynamic contrast enhancement and edge enhancement
• CAC and purple fringe removal
• Dehaze
• 6DoF DIS and rolling shutter correction
• LGDC and fisheye correction
• Image rotation by 90° or 270°
• Image mirroring and flipping
• Multi-channel 1/15.5x–16x scaling outputs
• OSD overlaying of up to eight regions before encoding
• ISP tuning tools on the PC

• BitBlt operation
• Line drawing
• Alpha blending
• Color key
• CSC

• 2-channel and 4-channel Any View Stitching (AVS)
• Stitching performance:
− 2-channel 3000 x 3000@30 fps VI and 3840 x 2160@30 fps VO
− 4-channel 1080 x 1920@30 fps VI and 3840 x 2160@30 fps VO

• HDMI 2.0, supporting up to 4K x 2K (4096 x 2160)@60 fps outputs
• 4-lane MIPI DSI, supporting up to 1080p@60 fps outputs
• 6-/8-/16-/24-bit digital LCD/BT.656/BT.1120 interface, supporting up to 1080p@60 fps RGB/YUV outputs
• Two independent HD VO channels (DHD 0 and DHD 1):
− Any two interfaces can be used for display from different sources.
− DHD 0 supports 36-picture display.
− DHD 1 supports 16-picture display.
• One PiP layer, which can be overlaid with DHD 0 or DHD 1
• Two full-screen GUI graphics layers in ARGB1555 or ARGB8888 format for DHD 0 and DHD 1
• One hardware cursor layer in ARGB1555 or ARGB8888 format (configurable), supporting a maximum resolution of 256 x 256
• One scaling WBC channel

• Hardware acceleration for binocular depth map computing, supporting the processing performance up to 720p@30 fps
• Hardware acceleration for IVE 2.1 intelligent operators for feature point detection, optical flow, computer morphology processing, and more

• Integrated audio codec, supporting 16-bit audio inputs and outputs
• Dual-channel differential MIC inputs for reducing background noise
• I²S interface for 8-channel audio TDM inputs and dual-channel audio outputs (mutually exclusive with the built-in audio codec)
• HDMI audio output

• Multi-protocol voice encoding and decoding implemented on software
• Audio encoding formats such as G.711, G.726, and AAC
• VQE

• One GE interface:
− RGMII and RMII modes
− 10/100 Mbit/s half-duplex or full-duplex
− 1000 Mbit/s full-duplex
− TSO for reducing the CPU overhead

• AES, DES, and 3DES algorithms implemented on hardware
• RSA1024/2048/3072/4096 signature verification algorithms implemented on hardware
• HASH_SHA1/224/256/384/512 and HMAC_SHA1/224/256/384/512 tamper proofing algorithms implemented on hardware
• Integrated 32-kbit OTP storage space and hardware random number generator
• Secure boot
• Memory and I/O security isolation

• 2x SDIO 3.0 interfaces:
− SDIO 0 supports the SDXC card.
− SDIO 1 supports the WiFi module.
• 1x USB 3.0/PCIe 2.0 multiplexing port
− USB 3.0 only or PCIe 2.0 x1 + USB 2.0.
− RC and endpoint supported as the PCIe 2.0 interface
− Configurable USB host/device mode as the USB 3.0 interface
• 1x USB 2.0 port, supporting configurable host/device mode
• Internal POR signal output and external reset input
• Independent battery for the built-in RTC
• Integrated 4-channel LSADC
• 9x UART interfaces (Some pins are multiplexed with others.)
• Multiple I²C, SPI, and GPIO interfaces
• 1x IR interface
• 8x PWM interfaces (Some pins are multiplexed with others.)

• 32-bit DDR4/LPDDR4 SDRAM interface
− Maximum frequency of 1333 MHz for the DDR4/LPDDR4 SDRAM
− Maximum DDR address space of 3.5 GB
• SPI NOR flash interface
− 1-/2-/4-wire mode
− 3-/4-byte address mode
− Maximum capacity of 256 MB
• SPI NAND flash interface
− SLC flash
− 2 KB/4 KB page size
− 8-/24-bit ECC (unit: KB)
− Maximum capacity of 1 GB
• NAND flash interface
− 8-bit data width
− SLC flash
− 2 KB/4 KB page size
− 8-/16-/24-bit ECC (unit: KB)
− Maximum capacity of 1 GB
• eMMC 5.1 interface
− HS400
− Maximum capacity of 2 TB
Configurable Boot Modes
• Booting from the BootROM
• Booting from the SPI NOR flash
• Booting from the SPI NAND flash
• Booting from the NAND flash
• Booting from an eMMC
Image Burning Modes
• Image burning through UART 0
• Image burning through an SD card
• Image burning through a USB device

• Linux SMP
• High-performance iOS/Android-based H.265 decoding library

• Power consumption
− 2.2 W power consumption in typical scenarios for 4K x 2K (3840 x 2160)@30 fps encoding + deep learning intelligent algorithm
− Multi-level power saving mode
• Operating voltages
− 0.8 V core voltage
− 1.8 V or 3.3 V I/O voltage
− 1.2 V DDR4 SDRAM interface voltage
− 1.1 V LPDDR4 SDRAM interface voltage
• Package
− RoHS-compliant FCCSP
− Body size: 15 mm x 15 mm
− Ball pitch: 0.65 mm and 0.4 mm
− Operating temperature: 0°C–70°C