This latest design powers multi-channel HD/UHD network video recorders. With powerful processor and inference engine, multiple intelligent algorithm applications are now a reality. Integrated with a variety of interfaces and image processing algorithms such as 3DNR and dynamic contrast adjustment, this SoC can be widely used in HD NVR and automotive markets.

Arm Cortex-A53 quad-core processor@1.15 GHz

6-channel 1080p30 H.265/H.264 decoding and two GE ports

1.2 TOPS of computing power

Key Features

  • Processor Cores

    • Arm Cortex-A53 quad-core@1.15 GHz
    − 32 KB L1 I-cache and 32 KB L1 D-cache
    − 512 KB L2 cache
    − Neon and FPU
  • Multi-Protocol Video Codec

    • H.265 Main Profile, Level 4.1 encoding
    • H.265 Main Profile, Level 5.0 decoding
    • H.264 Baseline/Main/High Profile, Level 4.2 encoding
    • H.264 Baseline/Main/High Profile, Level 5.1 decoding
    • MJPEG/JPEG Baseline encoding and decoding
  • Video Codec

    • H.265/H.264/JPEG multi-stream encoding and decoding performance:
    − 6x 1080p@30 fps H.265/H.264 decoding
    − 2x 1080p@30 fps H.265/H.264 encoding
    − 4x 1080p@30 fps JPEG decoding
    − 1x 1080p@30 fps JPEG encoding
    • Seven bit rate control modes (CBR, VBR, AVBR, CVBR, FIXQP, QPMAP, and QVBR)
    • Up to 20 Mbit/s output bit rate
    • ROI encoding
    • Color-to-grayscale encoding
  • SVP

    • NNIE
    − Multiple neural network options
    − 1.2 TOPS computing performance
    − Comprehensive APIs and toolchains
    − Multiple applications such as face detection, facial recognition, object detection, and object tracking
    • IVE
    − Object tracking
    • MAU
    − Single-precision or half-precision floats
    − Feature vector comparison
  • Video and Graphics Processing

    • Pre-processing and post-processing including deinterlacing, sharpening, 3DNR, DCI, and mosaic
    • Anti-flicker for video and graphic outputs
    • Video scaling (1/15x to 16x)
    • Graphics scaling (1/2x to 2x)
    • Up to four Cover regions
    • Up to 8-region OSD overlay
  • Video Interfaces

    • VO interfaces
    − One HDMI 1.4b output interface with the maximum output of 3840 x 2160@30 fps
    − One VGA HD output interface at up to 1080p@60 fps
    − One BT.1120 HD output interface at up to 1080p@60 fps
    − One CVBS SD output interface, supporting the PAL/NTSC standard output
    − Two independent HD VO channels (DHD 0 and DHD 1)
    • Two HD interfaces with display from different sources
    • DHD 0 supports 49-picture display.
    • DHD 1 supports 49-picture display.
    − One independent SD output channel (DSD 0)
    − One PiP layer, which can be overlaid with DHD 0 or DHD 1
    − Two graphics layers in ARGB1555, ARGB4444, or ARGB8888 format for DHD 0 and DHD 1, respectively
    − One special graphics layer, which supports CLUT 2/CLUT 4 and can be bound to DHD 0, DHD 1, or DSD 0
    − One hardware cursor layer in ARGB1555, ARGB4444, or ARGB8888 format (configurable) with a maximum resolution of 256 x 256
    • VI interfaces
    − One MIPI D-PHY/BT.656 multiplexing interface
    − One 16-bit BT.1120 interface
    − Four video input channels
    − Maximum input performance: 4-channel 1080p@30 fps
  • Audio Interfaces

    • Three unidirectional I2S/PCM interfaces
    − Two inputs, supporting 20 multiplexed inputs
    − One output, supporting dual-audio channel output
    • Audio codec
    − 16-bit voice input and output
  • ETH Interfaces

    • Two GE interfaces
    − RGMII and RMII modes
    − 10/100 Mbit/s half-duplex or full-duplex
    − 1000 Mbit/s full-duplex
    − TSO for reducing the CPU overhead
  • Security Engine

    • AES 128/192/256-bit encryption and decryption algorithms
    • RSA 2048/4096-bit encryption and decryption algorithms
    • OTP, providing 28-kbit user space to burn images
    • Hardware-based true random number generator
    • Secure boot
    • Secure memory isolation
  • Peripheral Interfaces

    • Two SATA 3.0/PCIe 2.0 combo interfaces
    − The interface combination modes can be as follows: 2*SATA, 1*SATA+1*PCIe x1, 1*PCIe x2.
    − When the combo interface is configured as PCIe 2.0, the RC and EP functions are supported.
    − When the combo interface is configured as SATA 3.0, the eSATA and PM functions are supported.
    • One USB 3.0 host interface
    • Two USB 2.0 host interface
    • Five UART interfaces, two of which support the 4-wire mode
    • One SPI interface, supporting four chip selects (CSs)
    • One IR interface
    • Two I2C interfaces
    • Multiple GPIO interfaces
  • Memory Interfaces

    • One 32-bit DDR4/DDR3 interface
    − Maximum DDR4 clock frequency: 1332 MHz
    − Maximum DDR3 clock frequency: 1066 MHz
    − Maximum capacity: 4 GB
    • One SD/MMC interface
    − eMMC 4.5/eMMC 5.0/eMMC 5.1
    − HS400 (150 MHz dual-edge)
    − SDIO 3.0 (non-SD card)
    • SPI NOR/NAND flash interfaces
    − Two CSs, which can be connected to different types of flash memories
    − For the SPI NOR flash:
    • 1-/2-/4-wire mode
    • 3-/4-byte address mode
    • Maximum capacity: 256 MB
    − For the SPI NAND flash:
    • SLC flash
    • 2 KB or 4 KB page size
    • 8- or 24-bit ECC (unit: KB)
    • Maximum capacity: 2 GB
  • RTC with Independent Power Supply

    Independent battery for supplying power to the RTC
  • Multiple Boot Modes

    • Booting from the BootROM
    • Booting from the SPI NOR flash
    • Booting from the SPI NAND flash
    • Booting from the eMMC
    • Booting from the slave chip over the PCIe interface
  • SDK

    • Linux SMP (64-bit)
    • Audio codec libraries that support multiple protocols
    • High-performance PC decoding library based on H.265/H.264
  • Chip Physical Specifications

    • Power consumption
    − Power consumption in typical scenarios (6-channel 1080p@30 fps decoding + 2-channel 1080p@30 fps encoding + deep learning intelligent algorithm): 3.1 W
    − Multi-level power consumption control
    • Operating voltages
    − Core voltage: 0.9 V
    − CPU voltage: 1.0 V
    − I/O voltage: 1.8 V/3.3 V
    − Voltage of the DDR4 interface: 1.2 V
    − Voltage of the DDR3 interface: 1.5 V
    • Package
    − Ball pitch: 0.8 mm
    − Dimensions: 22 mm x 22.4 mm
    − Operating temperature: 0°C–70°C

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