Hi3535AV100

• Arm Cortex-A53 quad-core@1.15 GHz
− 32 KB L1 I-cache and 32 KB L1 D-cache
− 512 KB L2 cache
− Neon and FPU

• H.265 Main Profile, Level 4.1 encoding
• H.265 Main Profile, Level 5.0 decoding
• H.264 Baseline/Main/High Profile, Level 4.2 encoding
• H.264 Baseline/Main/High Profile, Level 5.1 decoding
• MJPEG/JPEG Baseline encoding and decoding

• H.265/H.264/JPEG multi-stream encoding and decoding performance:
− 6x 1080p@30 fps H.265/H.264 decoding
− 2x 1080p@30 fps H.265/H.264 encoding
− 4x 1080p@30 fps JPEG decoding
− 1x 1080p@30 fps JPEG encoding
• Seven bit rate control modes (CBR, VBR, AVBR, CVBR, FIXQP, QPMAP, and QVBR)
• Up to 20 Mbit/s output bit rate
• ROI encoding
• Color-to-grayscale encoding

• NNIE
− Multiple neural network options
− 1.2 TOPS computing performance
− Comprehensive APIs and toolchains
− Multiple applications such as face detection, facial recognition, object detection, and object tracking
• IVE
− Object tracking
• MAU
− Single-precision or half-precision floats
− Feature vector comparison

• Pre-processing and post-processing including deinterlacing, sharpening, 3DNR, DCI, and mosaic
• Anti-flicker for video and graphic outputs
• Video scaling (1/15x to 16x)
• Graphics scaling (1/2x to 2x)
• Up to four Cover regions
• Up to 8-region OSD overlay

• VO interfaces
− One HDMI 1.4b output interface with the maximum output of 3840 x 2160@30 fps
− One VGA HD output interface at up to 1080p@60 fps
− One BT.1120 HD output interface at up to 1080p@60 fps
− One CVBS SD output interface, supporting the PAL/NTSC standard output
− Two independent HD VO channels (DHD 0 and DHD 1)
• Two HD interfaces with display from different sources
• DHD 0 supports 49-picture display.
• DHD 1 supports 49-picture display.
− One independent SD output channel (DSD 0)
− One PiP layer, which can be overlaid with DHD 0 or DHD 1
− Two graphics layers in ARGB1555, ARGB4444, or ARGB8888 format for DHD 0 and DHD 1, respectively
− One special graphics layer, which supports CLUT 2/CLUT 4 and can be bound to DHD 0, DHD 1, or DSD 0
− One hardware cursor layer in ARGB1555, ARGB4444, or ARGB8888 format (configurable) with a maximum resolution of 256 x 256
• VI interfaces
− One MIPI D-PHY/BT.656 multiplexing interface
− One 16-bit BT.1120 interface
− Four video input channels
− Maximum input performance: 4-channel 1080p@30 fps

• Three unidirectional I²S/PCM interfaces
− Two inputs, supporting 20 multiplexed inputs
− One output, supporting dual-audio channel output
• Audio codec
− 16-bit voice input and output

• Two GE interfaces
− RGMII and RMII modes
− 10/100 Mbit/s half-duplex or full-duplex
− 1000 Mbit/s full-duplex
− TSO for reducing the CPU overhead

• AES 128/192/256-bit encryption and decryption algorithms
• RSA 2048/4096-bit encryption and decryption algorithms
• SHA256/HMAC_SHA1/HMAC_SHA224/HMAC_SHA256
• OTP, providing 28-kbit user space to burn images
• Hardware-based true random number generator
• Secure boot
• Secure memory isolation

• Two SATA 3.0/PCIe 2.0 combo interfaces
− The interface combination modes can be as follows: 2*SATA, 1*SATA+1*PCIe x1, 1*PCIe x2.
− When the combo interface is configured as PCIe 2.0, the RC and EP functions are supported.
− When the combo interface is configured as SATA 3.0, the eSATA and PM functions are supported.
• One USB 3.0 host interface
• Two USB 2.0 host interface
• Five UART interfaces, two of which support the 4-wire mode
• One SPI interface, supporting four chip selects (CSs)
• One IR interface
• Two I²C interfaces
• Multiple GPIO interfaces

• One 32-bit DDR4/DDR3 interface
− Maximum DDR4 clock frequency: 1332 MHz
− Maximum DDR3 clock frequency: 1066 MHz
− Maximum capacity: 4 GB
• One SD/MMC interface
− eMMC 4.5/eMMC 5.0/eMMC 5.1
− HS400 (150 MHz dual-edge)
− SDIO 3.0 (non-SD card)
• SPI NOR/NAND flash interfaces
− Two CSs, which can be connected to different types of flash memories
− For the SPI NOR flash:
• 1-/2-/4-wire mode
• 3-/4-byte address mode
• Maximum capacity: 256 MB
− For the SPI NAND flash:
• SLC flash
• 2 KB or 4 KB page size
• 8- or 24-bit ECC (unit: KB)
• Maximum capacity: 2 GB

Independent battery for supplying power to the RTC

• Booting from the BootROM
• Booting from the SPI NOR flash
• Booting from the SPI NAND flash
• Booting from the eMMC
• Booting from the slave chip over the PCIe interface

• Linux SMP (64-bit)
• Audio codec libraries that support multiple protocols
• High-performance PC decoding library based on H.265/H.264

• Power consumption
− Power consumption in typical scenarios (6-channel 1080p@30 fps decoding + 2-channel 1080p@30 fps encoding + deep learning intelligent algorithm): 3.1 W
− Multi-level power consumption control
• Operating voltages
− Core voltage: 0.9 V
− CPU voltage: 1.0 V
− I/O voltage: 1.8 V/3.3 V
− Voltage of the DDR4 interface: 1.2 V
− Voltage of the DDR3 interface: 1.5 V
• Package
− RoHS, EHS-TFBGA
− Ball pitch: 0.8 mm
− Dimensions: 22 mm x 22.4 mm
− Operating temperature: 0°C–70°C