Innovative Products

Technology & Research


HiSilicon Empowers 4K@60fps Action Camera Industry by Releasing its Latest Hi3556A Chip

Hisilicon, the world's leading camera chipset supplier, will launch a new generation of 4k@60fps Smart Action Camera solution based on Hi3556A.

HiSilicon Releases Industry Leading 4K HDR10 solution for Memory Optimised Home Media Platforms

With the development support from Netflix,HiSilicon is pleased to announce the availability of its latest implementation of Google’s Android TV combined with Netflix’s latest 4K HDR10 app, focused on 1GB DDR footprint platforms, such as STB’s, Dongles and HDMI Sticks.

HiSilicon Ultra HD Chip Empower the Innovation and Upgrading of Guangdong 4K Industry

On March 29th, the China Ultra-HD Video (4K) Industry Development Conference was held in Guangzhou.

Hisilicon Delivery High-end 8K Camera SOC with Smart Vision Platform

The Hi3559C will support 8K HEVC at 30 frame per second or 4K HEVC at 120 frame per second with NPU inside.

HiSilicon Accelerates the Home Media Streaming Applications and Smart TV Industry by Releasing the Latest UHD Product Hi3751V811

The HI3751V551, is the next generation SoC in HiSilicon’s integrated UHD product family.

HiSilicon Empowers Skyworth to unveil the 4K Smart TV G6B/G3 Series with Hi3751V551 Inside

With the most advanced HiSilicon chipset Hi3751V551 inside, Skyworth unveils 4K Smart TV G6B/G3 series.

HiSilicon Empowers the Industry with Latest Technologies on End-to-end Terminal SoC Solution for Smart Home and Set-top-box at Convergence 2018

The Convergence is the largest event in India for providing business knowledge for the media, entertainment & technology industry, spanning the creation, management and delivery of electronic and media entertainment.

HiSilicon Attends TV CONNECT 2018 with its Latest Demos and Solutions

TV CONNECT 2018 as one of the most important Set Top Box event in Europe, has successfully held in London Olympia today.

Huawei Launches AI Development Platform HiKey 970

Huawei launched its world-leading AI development platform HiKey 970 at Linaro Connect Hong Kong 2018 on March 19.

Huawei Launches the World’s First 8-Antenna 4.5G Modem Chipset

On February 26, Huawei launched the world’s first 8-antenna 4.5G modem chipset Balong 765 and demonstrated its innovations in the application of mobile connectivity and Internet of Vehicles (IoV) for vertical sectors at the Mobile World Congress (MWC) 2018. As wireless network architecture evolves from 4G to 5G, Balong 765 provides reliable connectivity solutions and it reshapes the lifestyle.

Huawei Releases First 5G Customer-premises Equipment

BARCELONA – February 25, 2018 – Huawei today announced at Mobile World Congress the launch of its HUAWEI 5G customer-premises equipment (CPE), the world first commercial terminal device supporting the globally recognized 3GPP telecommunication standard for 5G. This device marks a milestone as Huawei sets the stage for the next generation of wireless connectivity.