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HiSilicon Launches Next Generation HD-HEVC SoC for Low Cost Set Top Box Applications

Shenzhen, China – 14th September, 2018 – HiSilicon Technologies Co., Ltd, a world leading fabless IC semiconductor company, officially launches at IBC 2018, Amsterdam, the next generation HD chipset with support for the industry leading Broadcast CA, HEVC video decoding and a Mutli-format Demodulator that supports DVB-C, DVB-S/S2/S2x, DVB-T/T2 and ISDB-T standards.

“As Operators worldwide are transitioning from Standard Definition to High Definition services, the HD STB market continues to grows, and as part of our continuing commitment to provide cost effective solutions for the Pay TV industry, we have developed the Hi3716MV430 to help address this transition”, said John Liu, General Manager of the STB Product Line at HiSilicon.

“Offering higher levels of integration, by embedding on-chip DDR, higher performance CPU and support for different integrated demodulator standards, we are able to create a very cost effective solution with worldwide appeal in a very small form factor.”

The Hi3716MV430, is the next generation SoC in HiSilicon’s fully integrated FHD product family. It offers higher levels of integration and performance over previous generations, while reducing the overall STB component count and power footprint. Targeted specifically to address the Broadcast and FTA platforms by offering a common H/W and S/W design approach which can greatly reduce costs and simplify overall product logistics.

Hi3716MV430 is sampling now and will be on display at IBC 2018 on HiSilicon Technologies Co., Ltd. Booth: Hall 2, A49, RAI, Amsterdam from September 14th – 18th 2018.