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HiSilicon Empowers SHARP to Unveil the 2nd Generation AQOUS 8K Smart TV Series with Hi3751V811 Inside

HiSilicon officially announced the collaboration with SHARP, one of the World’s largest and leading TV corporation. With HiSilicon’s most cutting-edge technology in chipset Hi3751V811, SHARP unveils the 2nd generation AQOUS 8K Smart TV 80, 70 and 60 series, supporting all state-of-the-art HDRs.

Huawei Launches Industry-Leading 5G Multi-Mode Chipset Balong 5000 to Lead the 5G Era

Huawei officially launched an industry-leading 5G multi-mode chipset called Balong 5000 – along with the first commercial 5G device powered by it, the Huawei 5G CPE Pro. Together, these two new products deliver superior connection experiences, providing a hardware foundation for enriching 5G application scenarios, and leading the 5G era.

Huawei Launches 5G Multi-mode Chipset and 5G CPE Pro

Huawei officially launched its 5G multi-mode chipset Balong 5000 today – along with the first commercial 5G device powered by it, the Huawei 5G CPE Pro. Together, these two new products provide the world's fastest wireless connections for your smartphone, your home, the office, and on the go.

Huawei Unveils Industry's Highest-Performance ARM-based CPU Bringing Global Computing Power to Next Level

Huawei has announced the industry's highest-performance Advanced RISC Machine (ARM)-based CPU. Called Huawei Kunpeng 920, the new CPU is designed to boost the development of computing in big data, distributed storage, and ARM-native application scenarios. Huawei will join with industry players to advance the ARM industry and foster an open, collaborative, and win-win ecosystem, taking computing performance to new heights.

Hisilicon announce full range of AI camera and MobileCam chip and solutoin

HiSilicon has launched a full range of low-power, high-performance AI camera chips and solutions to address the pain points of surveillance intelligence. The models are Hi3559AV100, Hi3519AV100, Hi3516DV300, Hi3516CV500, and have a variety of PQ+AI capability combinations, covering high-end 8K to low-end 1080P monitoring applications.

Hisilicon announce full range of AI camera and MobileCam chip and solutoin

HiSilicon has launched a full range of low-power, high-performance AI camera chips and solutions to address the pain points of surveillance intelligence. The models are Hi3559AV100, Hi3519AV100, Hi3516DV300, Hi3516CV500, and have a variety of PQ+AI capability combinations, covering high-end 8K to low-end 1080P monitoring applications.

HiSilicon released its latest 2M Mainstream and 4M Professional Smart IP Camera SoC Hi3516CV500 and Hi3516DV300

Along with the improvement of the industry and algorithms, Hi3516CV500 and Hi3516DV300 are particularly targeting on 2M and 4M IP Camera market through the advantages introduced as below.

HiSilicon released its latest 4K AI SoC Hi3519AV100

HiSilicon has released its latest 4K AI SoC Hi3519AV100 targeting in the mid-range surveillance market.

Smart VQE – A New Way to Improve Your Audio Experience

HiSilicon has released its latest 4K AI SoC Hi3519AV100 targeting in the mid-range surveillance market.

Huawei Launches the First Full-Stack All-Scenario AI Chip and Solution Ascend 310, Enabling the Smart Future

[October 10, 2018, Shanghai] Huawei has launched the first full-stack all-scenario AI chip Ascend 310 on HUAWEI CONNECT 2018.

HiSilicon Introduces Reference Solution to Simplify Adding Alexa Voice Service (AVS) to Set-Top Boxes

HiSilicon officially announces a reference solution available today that enables consumers to use the convenience of Alexa via a push-to-talk (PTT) voice remote for set-top box (STB) and TV applications.

HiSilicon Launches Next Generation HD-HEVC SoC for Low Cost Set Top Box Applications

HiSilicon officially launches at IBC 2018, Amsterdam, the next generation HD chipset with support for the industry leading Broadcast CA, HEVC video decoding and a
Mutli-format Demodulator that supports DVB-C, DVB-S/S2/S2x, DVB-T/T2 and ISDB-T standards.