Back

Applications

Smart Home
Media & Entertainment
Smart Home Services
Smart City
City Management
City Efficiency
Smart Mobility
ADAS
E-Cockpit
V2X
Tech Talk
PLC
8K
PQ
AVS3
NB-IoT
HDR Vivid
Smart Home

Products

Devices
Connectivity
Smart Media
Processors
Kirin
HUAWEI Ascend
Kunpeng
Balong
Gigahome
Developers
Smart IoT Platform
Smart Vision Platform

Support

Where to Buy
Sales Partners
Technical Support
Support
Contact Us
Contact Sales

About HiSilicon

Company Profile
Company Profile
Careers
News & Events
News
Events
Enabling Smart Devices

Search

No Result

Most Searched

Smart Home Smart City Smart Mobility

Quick Links

Where to Buy Contact Us
Huawei productdetail mob

HUAWEI Ascend 310

HUAWEI Ascend 310 is a highly efficient, flexible and programmable AI processor. 16 TOPS@INT8 and 8 TOPS@FP16 can be output in typical configuration, while power consumption remains at just 8 W. HUAWEI Ascend 310 utilizes HUAWEI-developed Da Vinci Architecture, integrates a wide variety of computing units, and extends the application scope of the AI chip. Through the acceleration of all-AI service processes, the AI system's overall performance is greatly improved while deployment costs are reduced significantly.
  • feature1

    HUAWEI Da Vinci NPU architecture

  • feature2

    16 TOPS@INT8

  • feature3

    3D Cube computing engine

Key Features

Architecture

• HUAWEI Da Vinci
Computing Engine

• 3D Cube
Performance

• 16 TOPS@INT8 and 8 TOPS@FP16
Max Power

• 8 W
Process

• 12 nm FFC
support banner support mob
Technical Support
HiSilicon Official Site
/
HUAWEI Ascend AI Chipsets
/
HUAWEI Ascend 310 Chipset

Follow Us

Contact Us

©2024 Huawei Technologies Co., Ltd.
Terms of Use Privacy