Kirin 820 Chipset | HiSilicon Official Site

This SoC works with both SA/NSA and TDD/FDD full-frequency bands for reliable and stable 5G connections. Its HUAWEI-designed Da Vinci NPU lets Kirin 820 offer 73% more AI computing power with less power consumption. Thanks to its multi-core CPU, this generation's performance is improved by 27%. The Mali-G57 GPU, backed by Kirin Gaming+ 2.0 technology, boosts performance by 38% and energy efficiency by 39% for uninterrupted gaming. Photography enthusiasts can take advantage of HUAWEI-developed ISP 5.0 for clearer night-time photos.

5G SoC for the best 5G experience
HUAWEI Da Vinci NPU architecture
1+3+4 robust and energy efficient CPU architecture, Mali-G57 GPU

Key Features

Process

• 7 nm

CPU

• 1x Cortex-A76@2.36 GHz
• 3x Cortex-A76@2.22 GHz
• 4x Cortex-A55@1.84 GHz

GPU

• 6-core Mali-G57, Kirin Gaming+ 2.0

AI

• HUAWEI Da Vinci Architecture, Ascend D110 Lite
• HiAI 2.0

Modem

• 2G/3G/4G/5G
• SA&NSA fusion network architecture
• FDD&TDD spectrum access, DSDS3.x

ISP

• Kirin ISP 5.0
• BM3D DSLR-level image noise reduction, dual-domain video noise reduction

Memory

• LPDDR4X

Technical Support

Shanghai

Room 101, 2 Hongqiaogang Road, Qingpu District, Shanghai

+86 755 28780808

support@hisilicon.com
Shenzhen

New R&D Center, 49 Wuhe Road, Bantian, Longgang District, Shenzhen

+86 755 28780808

support@hisilicon.com

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Kirin 820

5G SoC for the best 5G experience

HUAWEI Da Vinci NPU architecture

1+3+4 robust and energy efficient CPU architecture, Mali-G57 GPU

Key Features

Process

CPU

GPU

AI

Modem

ISP

Memory

Shanghai

Shenzhen