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Hi3873V100
Wi-Fi 6/NearLink/BLE combo SoC with transparent broadband transmission
Hi3873V100 is highly integrated single chip that features a 2.4GHz Wi-Fi subsystem, a NearLink subsystem and a Bluetooth Low Energy(BLE) subsystem. It is compatible with IEEE 802.11ax (also known as Wi-Fi 6) and with earlier standards IEEE 802.11 b/g/n. The chip integrates the IEEE 802.11 b/g/n/ax baseband and radio frequency (RF) circuits. The RF circuit consists of the power amplifier (PA), low-noise amplifier (LNA), RF balun, antenna switch, and power management module. As a slave chip, Hi3873V100 runs by connecting to the master chip in the plug-in devices, such as IP cameras, FHD TVs and entry-level 4K smart TVs.
Regarding Wi-Fi, the chip supports 802.11n 20 MHz/40 MHz and 802.11ax 20 MHz frequency bandwidth, and operates with a maximum physical layer bit rate of 150 Mbps, contributing to larger transmit power and better coverage.
Regarding BLE, it supports 1MHz and 2 MHz frequency bandwidths, compatibles with BLE 4.0/4.1/4.2/5.0/5.1/5.2 protocols. The BLE maximum physical layer bit rate is 2 Mbps.
Regarding NearLink, it supports SLE 1 MHz, 2 MHz, and 4 MHz frequency bandwidths, compatible with SLE 1.0. As an SLE gateway, it supports a maximum physical layer bit rate of 12 Mbps.
Regarding Wi-Fi, the chip supports 802.11n 20 MHz/40 MHz and 802.11ax 20 MHz frequency bandwidth, and operates with a maximum physical layer bit rate of 150 Mbps, contributing to larger transmit power and better coverage.
Regarding BLE, it supports 1MHz and 2 MHz frequency bandwidths, compatibles with BLE 4.0/4.1/4.2/5.0/5.1/5.2 protocols. The BLE maximum physical layer bit rate is 2 Mbps.
Regarding NearLink, it supports SLE 1 MHz, 2 MHz, and 4 MHz frequency bandwidths, compatible with SLE 1.0. As an SLE gateway, it supports a maximum physical layer bit rate of 12 Mbps.
In the Hi3873V100 series, there are 3 types of packages according to SLE capability and host interface:
• Hi3873U: USB 2.0 host interface; 1 MHz or 2 MHz SLE RF bandwidth and SLE physical bit rate up to 4 Mbps
• Hi3873S: SDIO 2.0 host interface; 1 MHz or 2 MHz SLE RF bandwidth and SLE physical bit rate up to 4 Mbps
• Hi3873E: USB 2.0 host interface; 1 MHz, 2 MHz or 4 MHz SLE RF bandwidth and SLE physical bit rate up to 12 Mbps
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High integration
Coexistence and concurrency of Wi-Fi 6, BLE, and SLE
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Robust connectivity
Wi-Fi 6 is fast and has powerful anti-interference capabilities
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Ease of use
NearLink/Bluetooth network configuration is simple, with a high success rate
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IoT gateway
Bluetooth/NearLink device access and multi-device linkage
Wi-Fi 6 Connectivity
Higher transmission speeds and more concurrent connections
Wi-Fi 6 introduces OFDMA, spatial reuse (SR), and BSS Coloring to mitigate co-channel interference and upscale concurrent connections. Wi-Fi 6 supports higher-order modulation and smaller subcarriers to provide higher rates. Multi-user multiple-input multiple-output (MU-MIMO) technologies, coupled with a beamforming technique, enable APs to communicate with multiple devices simultaneously, thereby allowing for more concurrent connections and better coverage.
In addition to the standard Wi-Fi bands, the product also supports dynamic narrowband Wi-Fi bands. This means that, for scenarios where speed is not critical, the product can reduce the Wi-Fi spectrum bandwidth to provide better coverage.
In addition to the standard Wi-Fi bands, the product also supports dynamic narrowband Wi-Fi bands. This means that, for scenarios where speed is not critical, the product can reduce the Wi-Fi spectrum bandwidth to provide better coverage.
NearLink Connectivity
Ultra-low delay air interfaces for an ultimate experience
With a novel physical layer, NearLink SLE supports smaller air interface timeslots, leading to greatly reduced end-to-end latency. Its polar code–based channel coding delivers over 7 dB coverage gains and anti-interference capabilities. It supports spectrum resource allocation based on center scheduling and uses an innovative channel scanning and selection mechanism. As such, it implements SLE fast frequency hopping and optimal channel selection, bringing great leaps in connectivity stability and transmission reliability. NearLink SLE also supports larger air interface bandwidth and higher-order modulation. Compared with traditional short-range technologies, SLE offers much higher air interface transmission rates.
Simplified Network Configuration and Fast Fault Locating
Higher network configuration success rates and lower return rates
The product can auto-discover NearLink devices within range; and complete device registration on the cloud through a secure and reliable communication channel.
When pairing with Nearlink-incapable devices, the product auto-switches to a traditional network configuration mode (such as the BLE or SoftAP-assisted).The product reports network configuration errors and guides the user through troubleshooting steps, so as to reduce return and replacement caused by network configuration failures. Collection of network configuration exception data helps with informed improvements.
When pairing with Nearlink-incapable devices, the product auto-switches to a traditional network configuration mode (such as the BLE or SoftAP-assisted).The product reports network configuration errors and guides the user through troubleshooting steps, so as to reduce return and replacement caused by network configuration failures. Collection of network configuration exception data helps with informed improvements.
Key Features
Wi-Fi• 1x1 2.4 GHz (ch1 to ch14) Wi-Fi Station
• Physical layer (PHY): IEEE 802.11b/g/n/ax • MAC layer: IEEE802.11 d/e/h/i/k/v/w • 802.11n 20 MHz/40 MHz frequency bands and 802.11ax 20 MHz frequency bands • Maximum rate: 150 Mbps@HT40 MCS7, 114.7 Mbps@HE20 MCS9 • Built-in power amplifier (PA) and low noise amplifier (LNA); TX/RX switch and balun • STA, AP (allows for up to 8 STAs), and P2P modes • STA+AP coexistence and STA+P2P coexistence • Aggregate MAC service data unit (A-MPDU) and aggregate MAC protocol data unit (A-MSDU) • Block-ACK • Quality of service (QoS) • WPA/WPA2/WPA3-Personal and WPS2.0 • Self-calibration for RF hardware • STBC and LDPC |
Bluetooth• Bluetooth Low Energy (BLE)
• BLE 4. 0/4. 1/4. 2/5. 0/5. 1/5. 2 • Rates: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps • Class 1 • High power of 20 dBm • BLE Mesh and BLE gateway |
NearLink• NearLink Low Energy (SLE)
• SLE 1.0. • SLE 1 MHz/2 MHz/4 MHz, up to 12 Mbps air interface rate • Polar code–based channel coding • SLE gateway |
CPU Subsystem• High-performance 32-bit microprocessor with a maximum operating frequency of 240 MHz
• 300 KB of SRAM and 430 KB of ROM |
Peripheral Interfaces• 1x SDIO slave interface or 1x USB 2.0 interface and 2x UART interfaces
• 11x GPIO interfaces when SDIO is used • 14x GPIO interfaces when USB is used • External crystal clock frequency: 24 MHz or 40 MHz |
Other• Input voltage: 3 V to 3.6 V (typical value: 3.3 V)
• Input/output (I/O) power voltage: 1.8 V or 3.3 V • Package: QFN32, 4 mm x 4 mm • Operating temperature: –40°C to +85°C |
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