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HiSilicon Releases Leading LTE Multi-mode Chipset

Barcelona, Spain, February 27, 2012 – HiSilicon Technologies today releases Balong 710, the world’s first multi-mode chipset supporting 3GPP Release 9 and LTE Category 4 at GTI (Global TD-LTE Initiative), MWC 2012.

Some leading features of Balong 710 are as following:

  • LTE FDD mode : 150Mbit/s downlink and 50Mbit/s uplink.

  • TD-LTE mode: up to 112Mbit/s downlink and up to 30Mbit/s uplink.

  • WCDMA Dual Carrier with MIMO: 84Mbit/s downlink and 23Mbit/s uplink.

  • Dual-Layer Beam Forming technology that can significantly improve average throughput, especially at the edge of cell.

“TD-LTE has become one of the core drivers of LTE development globally and HiSilicon has committed to invest in terminal chipset solutions for years, which can support both TD-LTE and FDD-LTE.” said Eric Xu, Chairman of HiSilicon Technologies, “Going forward, HiSilicon will deliver more powerful chipset solutions for smartphone and tablet through innovations around the needs of operators and consumers, to improve user experience and user perception.” Earlier at MWC 2012, HiSilicon also launched its high-performance application processor, K3V2, which is adopted by Huawei's newly announced flagship smartphone Ascend D quad. Powered by Balong 710 and K3V2, HiSilicon can provide leading smartphone and tablet platform in the industry.

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