Chipsets

Kirin 970

TSMC 10nm process technology integrates 5.5 billion transistors onto this fingernail-sized chip. Combining an octa-core CPU, a 12-core GPU, dual ISP, 1.2 Gbps high-speed Cat.18 LTE modem, and HiAI mobile computing architecture, Kirin 970 gives you connections, computing, high definition, and battery life.

TSMC 10 nm pioneer with 5.5 billion transistors

Integrated dedicated NPU

4*4MIMO, 5CC CA, 256QAM for optimized signaling

Key Features

  • Process

    • 10nm
  • CPU

    • 4x A73 +4x A53
  • GPU

    • 12 core Mali-G72
  • AI

    • Dedicated NPU
  • Modem

    • LTE Cat18/13 1.2Gbps DL / 150 Mbps UL
  • ISP

    • Dual ISP with face & motion detection
    • 4-Hybrid Focus Low-light & Motion Shooting
  • Coprocessor

    • i7 sensor coprocessor
  • Memory

    • LPDDR4X
  • Voice solutions

    • Dual SIM, Dual VoLTE
  • Audio

    • 32bit@384 KHz HD audio
    • AI noise reduction
  • Video

    • 4K video, HDR 10
  • Security solutions

    • inSE 2.0

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