HiSilicon is always looking to improve our products and services in the optical data center field. We heavily research the core capabilities of compounds and silicon photonics. As such, we have built E2E industry capabilities in optoelectronics technologies, chip packaging, component packaging, module design, to manufacturing, and provide optical modules with high performance, low power consumption, and high integration.

HiSilicon has persistently invested in PAM4. We have actively participated in the technology's evolution from ideation to mature commercial use, helping improve optical module rates. Using PAM4, we apply a high-performance interconnection system design to provide stable and reliable high-speed optical connections for data communication.