Chipsets

Kirin 990 5G

Cutting-edge 7nm+ EUV process builds the world's first full-frequency 5G SoC with peak downlink rates. Another first – its HUAWEI Da Vinci architecture NPU with all new Tiny-Core that marries intelligent computing power with ultra-low power consumption. Its CPU and GPU deliver a fast and smooth user experience. The camera is enhanced even in low light thanks to block-matching and 3D filtering (BM3D) and Dual-Domain video noise reduction. This enhanced Kirin 990 gives you a 4G mobile experience with upgraded performance, energy efficiency, AI, and photography.

World's first flagship 5G SoC

7nm+ EUV process

HUAWEI Da Vinci architecture dual-core NPU with tiny-core NPU

Key Features

  • Process

    • 7nm+ EUV
  • CPU

    • 2xA76-Based@2.86GHz +
    • 2xA76-Based@2.36GHz +
    • 4xA55@1.95GHz
  • GPU

    • 16 core Mali-G76
  • AI

    • HUAWEI Da Vinci Architecture,
    • Ascend Lite*2+Ascend Tiny*1
    • HiAI 2.0
  • Modem

    • 2G/3G/4G/5G
    • SA & NSA Fusion Network Architecture
    • FDD & TDD Spectrum Access
  • ISP

    • Kirin ISP 5.0
    • BM3D DSLR-Level image noise reduction, Dual-Domain video noise reduction
  • Memory

    • LPDDR4X

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