Chipsets

Kirin 990 5G

Cutting-edge 7 nm+ EUV process builds the world's first full-frequency 5G SoC with peak downlink rates. Another first – its HUAWEI Da Vinci Architecture NPU with all new tiny-core that marries intelligent computing power with ultra-low power consumption. Its CPU and GPU deliver a fast and smooth user experience. The camera is enhanced even in low light thanks to block-matching and 3D filtering (BM3D) and dual-domain video noise reduction. This enhanced Kirin 990 gives you a 4G mobile experience with upgraded performance, energy efficiency, AI, and photography.

World's first flagship 5G SoC

7nm+ EUV process

HUAWEI Da Vinci architecture dual-core NPU with tiny-core NPU

Key Features

  • Process

    • 7 nm+ EUV
  • CPU

    • 2x Cortex-A76@2.86 GHz
    • 2x Cortex-A76@2.36 GHz
    • 4x Cortex-A55@1.95 GHz
  • GPU

    • 16-core Mali-G76
  • AI

    • HUAWEI Da Vinci Architecture,
    • 2x Ascend Lite + 1x Ascend Tiny
    • HiAI 2.0
  • Modem

    • 2G/3G/4G/5G
    • SA & NSA fusion network architecture
    • FDD & TDD spectrum access
  • ISP

    • Kirin ISP 5.0
    • BM3D DSLR-level image noise reduction, dual-domain video noise reduction
  • Memory

    • LPDDR4X

View More Products

Support

HV2 Product Support Intro
Technical Support
banner