Kirin 990 5G Chipset | HiSilicon Official Site

Cutting-edge 7 nm+ EUV process builds the world's first full-frequency 5G SoC with peak downlink rates. Another first – its HUAWEI Da Vinci Architecture NPU with all new tiny-core that marries intelligent computing power with ultra-low power consumption. Its CPU and GPU deliver a fast and smooth user experience. The camera is enhanced even in low light thanks to block-matching and 3D filtering (BM3D) and dual-domain video noise reduction. This enhanced Kirin 990 gives you a 4G mobile experience with upgraded performance, energy efficiency, AI, and photography.

World's first flagship 5G SoC
7 nm+ EUV process
HUAWEI Da Vinci Architecture (dual-core NPU with tiny-core NPU)

Key Features

Process

• 7 nm+ EUV

CPU

• 2x Cortex-A76@2.86 GHz
• 2x Cortex-A76@2.36 GHz
• 4x Cortex-A55@1.95 GHz

GPU

• 16-core Mali-G76

AI

• HUAWEI Da Vinci Architecture,
• 2x Ascend Lite + 1x Ascend Tiny
• HiAI 2.0

Modem

• 2G/3G/4G/5G
• SA & NSA fusion network architecture
• FDD & TDD spectrum access

ISP

• Kirin ISP 5.0
• BM3D DSLR-level image noise reduction, dual-domain video noise reduction

Memory

• LPDDR4X

Technical Support

Shanghai

Room 101, 2 Hongqiaogang Road, Qingpu District, Shanghai

+86 755 28780808

support@hisilicon.com
Shenzhen

New R&D Center, 49 Wuhe Road, Bantian, Longgang District, Shenzhen

+86 755 28780808

support@hisilicon.com

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Kirin 990 5G

World's first flagship 5G SoC

7 nm+ EUV process

HUAWEI Da Vinci Architecture (dual-core NPU with tiny-core NPU)

Key Features

Process

CPU

GPU

AI

Modem

ISP

Memory

Shanghai

Shenzhen