Chipsets

Kirin 820

This SoC works with both SA/NSA and TDD/FDD full-frequency bands for reliable and stable 5G connections. Its Huawei-designed Da Vinci NPU lets Kirin 820 offer 73% more AI computing power with less power consumption. Thanks to its multi-core CPU, this generation's performance is improved by 27%. The Mali-G57 GPU, backed by Kirin Gaming+ 2.0 technology, boosts performance by 38% and energy efficiency by 39% for uninterrupted gaming. Photography enthusiasts can take advantage of Huawei-developed ISP 5.0 for clearer night-time photos.

5G SoC for the best 5G experience

HUAWEI Da Vinci NPU architecture

1+3+4 robust and energy efficient CPU architecture Mali-G57 GPU

Key Features

  • Process

    • 7nm
  • CPU

    • 1*Cortex-A76 Based@2.36GHz +
    • 3*Cortex-A76 Based@2.22GHz +
    • 4*Cortex-A55@1.84GHz
  • GPU

    • 6-core Mali-G57, Kirin Gaming+ 2.0
  • AI

    • HUAWEI Da Vinci Architecture, Ascend D110 Lite,
    • HiAI2.0
  • Modem

    • 2/3/4/5G,
    • SA&NSA fusion network architecture,
    • FDD&TDD Spectrum Access, DSDS3.x
  • ISP

    • Kirin ISP 5.0
    • BM3D DSLR-Level image noise reduction, Dual-Domain video noise reduction
  • Memory

    • LPDDR4X

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