Chipsets

Kirin 810

An NPU with HUAWEI Da Vinci Architecture enables Kirin 810 to be energy-efficient for any AI application. The state-of-the-art 7 nm SoC is 20% more efficient and 50% more transistor-dense than an 8 nm chip. The CPU (system-level AI frequency modulation scheduling and innovative 2+6 core architecture) and GPU (custom Mali-G52 with Kirin Gaming+ experience) equip the Kirin 810 for photographic, communications, and AI applications.

Camera ISP performance and algorithms, NR, detail enhancement

Dual-SIM dual-VoLTE high-speed mobile communications

Huawei HiAI compatibility

Key Features

  • Process

    • 7 nm
  • CPU

    • 2x Cortex-A76@2.27 GHz + 6x Cortex-A55@1.88 GHz
  • GPU

    • Mali-G52
  • AI

    • HUAWEI Da Vinci Architecture
    • Ascend D100 Lite
  • Modem

    • LTE Cat 12/13 UL
  • ISP

    • Kirin ISP4.0
  • Memory

    • LPDDR4X@2133 MHz
  • Voice

    • Dual SIM dual VoLTE

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