Chipsets

Kirin 820

This SoC works with both SA/NSA and TDD/FDD full-frequency bands for reliable and stable 5G connections. Its Huawei-designed Da Vinci NPU lets Kirin 820 offer 73% more AI computing power with less power consumption. Thanks to its multi-core CPU, this generation's performance is improved by 27%. The Mali-G57 GPU, backed by Kirin Gaming+ 2.0 technology, boosts performance by 38% and energy efficiency by 39% for uninterrupted gaming. Photography enthusiasts can take advantage of Huawei-developed ISP 5.0 for clearer night-time photos.

5G SoC for the best 5G experience

HUAWEI Da Vinci NPU architecture

1+3+4 robust and energy efficient CPU architecture Mali-G57 GPU

Key Features

  • Process

    • 7 nm
  • CPU

    • 1x Cortex-A76@2.36 GHz
    • 3x Cortex-A76@2.22 GHz
    • 4x Cortex-A55@1.84 GHz
  • GPU

    • 6-core Mali-G57, Kirin Gaming+ 2.0
  • AI

    • HUAWEI Da Vinci Architecture, Ascend D110 Lite
    • HiAI 2.0
  • Modem

    • 2G/3G/4G/5G
    • SA&NSA fusion network architecture
    • FDD&TDD spectrum access, DSDS3.x
  • ISP

    • Kirin ISP 5.0
    • BM3D DSLR-level image noise reduction, dual-domain video noise reduction
  • Memory

    • LPDDR4X

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