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Hi2825V100
High-performance and low-power SLE multi-mode SoC
Not launched yet, release strategy undecided
Hi2825V100 is a highly integrated SLE combo SoC. It comes equipped with high-performance, SLE 1.0, and RF circuits. The RF circuit consists of the power amplifier (PA), low noise amplifier (LNA), antenna, and power supply management modules. NearLink Low Energy (SLE) supports three bandwidths: 1 Mbps, 2 Mbps, and 4 Mbps. The maximum rate at the physical layer is 8 Mbps. Hi2825V100 also integrates a high-performance 32-bit microprocessor (MCU) and a large-capacity SRAM and flash memory. It allows programs to run in flash memory and comes with a hardware security engine.
Hi2825V100 has a wide range of peripheral interfaces – USB2.0 High Speed, SPI, UART, I2C, PWM, GPIO, PDM, I2S/PCM, and supports the 8-channel 12-bit 4Msps SAR ADC and 1-channel 16-bit 1Msps SAR ADC (high performance).
Hi2825V100 supports LiteOS. The complete set of user manuals, open and easy-to-use software SDKs and tools, and detailed hardware reference design – all are provided to create an enjoyable experience with the product.
Hi2825V100 can be used in many different HID peripherals such as VR controllers, e-competition keyboards, mouse devices, and stylus, and consumer electronics such as PCs, tablets, TVs, and STBs.
Hi2825V100 has a wide range of peripheral interfaces – USB2.0 High Speed, SPI, UART, I2C, PWM, GPIO, PDM, I2S/PCM, and supports the 8-channel 12-bit 4Msps SAR ADC and 1-channel 16-bit 1Msps SAR ADC (high performance).
Hi2825V100 supports LiteOS. The complete set of user manuals, open and easy-to-use software SDKs and tools, and detailed hardware reference design – all are provided to create an enjoyable experience with the product.
Hi2825V100 can be used in many different HID peripherals such as VR controllers, e-competition keyboards, mouse devices, and stylus, and consumer electronics such as PCs, tablets, TVs, and STBs.
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Support 4K wireless HIDs
Ultra-low latency, wireless true 4K; 2x anti-interference improvement; 12 Mbps peak rate via air interface
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SLE+USB
SLE 1.0/USB 2.0; NearLink 4K and wired 8K; 16-bit high-precision ADC
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High Computing Power and Large Capacity Storage
32-bit MCU, 96 MHz, floating point, 512 KB of SRAM, and 1 MB of flash memory
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Ultra-Low Power and Excellent Security
µA-level power consumption when in deep sleep; µA/Hz-level power consumption when the MCU is running Built-in secure boot, supporting multiple encryption algorithms such as SM algorithms
NearLink Connectivity
Ultra-low delay air interfaces for an ultimate experience
With a novel physical layer, NearLink SLE smaller timeslots leading to greatly reduced end-to-end latency. Its polar code–based channel coding delivers over 7 dB coverage gains and anti-interference capabilities. It allocate resource based on center scheduling and uses an innovative channel scanning and selection mechanism, delivering fast frequency hopping and optimal channel selection, bringing great leaps in connectivity stability and transmission reliability. NearLink SLE also supports higher bandwidth and higher-order modulation to offer much much higher transmission speed.
SLE+USB
Flexible connectivity to support peripherals
NearLink SLE + USB 2.0 High Speed enable up to 8 KHz wired performance. With a 16-bit high-precision SAR ADC built-in, the product also provides oversampling and automatic calibration, and it can be used to collect various physical data, including pressure and environmental parameters.
Key Features
NearLink• SLE 1.0
• SLE 1 MHz/2 MHz/4 Hz • Maximum air interface rate: 8 Mbps • Polar code–based channel coding • Maximum 4K return rate • Type 1 radio frame • Type 2 radio frame |
MCU• High-performance RISC-V 32-bit MCU
• Operating frequency: 96 MHz • 512 KB of built-in SRAM • 1 MB of built-in flash memory • eFuse/SM4 • Secure storage and secure boot |
Peripheral Interfaces• USB 2.0 FS/HS, 16-bit SAR ADC, 48 GPIO
• 32 MHz crystal oscillator, 32 kHz crystal, 32 kHz RC oscillator |
Other• Input voltage: 2.5 V to 4.5 V (typical value: 3.3 V)
• Package: TFBGA 110 (6.7 mm x 7.3 mm) • Operating temperature: –30°C to +85°C |
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