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Smartphones and Wearables
Connectivity series chips for smartphones and SoC processors for wearables
HiSilicon's connectivity series chips, specially designed for smartphone Kirin SoCs, are jam-packed with connectivity technologies – Wi-Fi, Bluetooth, GNSS, FM, and IR. Since mass production began for its first chip member in 2014, the connectivity series chip lineup has reached hundreds of millions of units in shipment, making their way into Huawei Mate, P, and Nova series smartphones.
Apart from smartphones, the lineup also provides options for other mobile devices. For example, due to the outstanding performance, low power consumption, and compact size of Hi110X, it is widely used in drones, action cameras, and mobile broadband devices.
HiSilicon wearable chips are mainly used in wrist-worn devices – such as light smart watches and smart bands, and head-mounted audio devices such as TWS headsets. They help wearable devices deliver an HD audio experience, accompanied by reliable connectivity, low power consumption, and punchy display.
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