5G Pre-Module

The industry-leading B5000 5G NR multimode Pre-Module solution for both Sub-6GHz and mMwave combines the baseband Hi9500 chip, Hi6365/Hi6370 RF chip, Hi6421/Hi6422 power management unit, and LNA components to serve advanced NR multimode modules and devices.

SA/NSA networking and all communication standards

One-stop chipset solution from baseband to RF

Proprietary 5G+X (WiFi/Camera/V2X) solution

Key Features

  • General Features

    • LTE Category 19
    • 2 Arm Cortex-A73 dual core processor @ 1200MHz,1 Arm Cortex-M3 processor@267MHz
    • Dedicated DSP Processor and Hardware logic for physical layer processing
    • Dedicated audio processor HiFi3@ 533MHz
    • 32bits LPDDR4x
    • 8bits NandFlash
    • Power supply: 0.9V/1.2V/1.8V/2.5V/3.3
    • Peripheral interfaces
    • Advanced semiconductor process
    • ESD voltage:±2000V
    • Hi9500: FCCSP 12.6mm*13.4mm 798 Pin
  • Communication Features

    • 3GPP R15
    • Sub6G DL:2*100MHz 4*4MIMO
    • HF DL:4*200MHz 2*2MIMO
    • Sub6G Only peak throughput
    -DL:100M+100M BW+4x4MIMO+256QAM(4.6Gbps)
    -UL:100M BW+2x2MIMO+256QAM(1.2Gbps)
    • LTE+Sub6G peak throughput -
    DL:LTE(300Mbps)+5G Sub6G 100M BW+4x4MIMO+256QAM(2.3Gbps)
    -UL:LTE(50Mbps)+5G Sub6G 100M BW+2x2MIMO+256QAM(1.05Gbps)
    • LTE+HF peak throughput -DL:LTE(300Mbps)+5GHF(200M+200M+200M+200MIntra-Band continues)BW+2x2MIMO+64QAM(6.3Gbps)
    -UL:LTE(50Mbps)+5G HF 200M BW+2x2MIMO+64QAM(1.55Gbps)
    • 3GPP R13/R14
    • Inter-Operability in different RAT
    • Bandwidth:1.4M/3M/5M/10M/15M/20M
    • MIMO:DL 4*2MIMO, 2*2MIMO
    • LTE Cat 19, DL throughput up to 1.6Gbps / UL throughput up to 150Mbps
    • UMTS 3GPP FDD R5/6/7/8/9
    • CPC, Enhanced F_DPCH,DL Enhanced Cell_FACH,UL_Enhanced CELL_FACH
    • R9 DC-HSPA+ dual carrier
    -DL Cat 24, throughput up to 42Mbps
    -UL Cat 7, throughput up to 5.76Mbps GSM/GPRS/EDGE
    • GSM/GPRS/EDGE Service
    • GPRS/EGPRS ClassB Class 33
    • A5-1/A5-2/A5-3/GEA1/GEA2/GEA3/GEA4
  • Frequency Band Coverage

    • NR: FR1(N1,2,3,…41,78,79,etc),N257,N258
    • LTE FDD: Band 1~Band 14, Band 17~Band 28
    • LTE TDD: Band 33~Band 41(including AXGP)
    • UMTS: Band 1~Band 6, Band 8, 9, 11, 19
    • GSM: Band 2,3,5,8
  • Interfaces

    5000 supports variety of interfaces to connect with external peripherals including:
    • 4*UART;
    • 1*BBP_UART, for managing co-existence of LTE and WiFi
    • 2*SPI controller, SPI0 for Master and Slave mode, SPI1 for Master mode only;
    • 5*I2C for Master mode only;
    • 1*USB3.1 /3.0/2.0;
    • 1*MMC, up to 200MHz, interface voltage 1.8V;
    • 32 bit LPDDR4x, up to 3733Mbps;
    • RGMII/MII/RevMII, can be configured to be duplex;
    • 1*LCD/Nand-Flash multiplex interface
    • 2*USIM, 1.8/3.0V;
    • Number of GPIOs;
    • 3*PCM/I2S audio interface, PCM0 can be multiplexed to be ZSI to connect with SLIC;
    • PWM;
    • 3*PCIE 3.0/2.0/1.1, support both RC(Root Complex)mode and EP(End Point)mode, support L1SS low power consumption mode;
    • 2*JTAG for both two-line and 5-line mode;

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