HiSilicon Boudica 200 provides a highly integrated and power efficient LPWA IoT solution, which complies with 3GPP NB-IoT specifications Rel-13/14/15/R16. Boudica 200 is a new member of the popular NB-IoT Boudica family. Built with the state-of-the-art technologies, Boudica 200 has 3 CPUs for applications, protocol and security, which provide the ultimate performance, as well as the best-in-class security. Compared with previous Boudica members, Boudica 200 not only has baseband, RF transceiver, but also integrates power amplifier, iSIM, power management unit and memories. With all these functions in one Boudica 200 chip, the overall EBOM and module product size can be significant reduced. Boudica 200 also supports BLE5.0 to better support near-end maintenance. GNSS is another new positioning feature in Boudica 200 besides OTDOA/ECID to enable more versatile applications. The ultra-low power design is applied at system level, in the different 3GPP modes of operation (DRX/eDRX/PSM), which effectivly reduces power consumption and extends the battery life.