Chipsets

Hi3861V100

This cost-effective chip powers your smart home with a IEEE 802.11b/g/n baseband and RF circuit (power amplifier, low noise amplifier, RF balun, antenna switch, and power management module). Thanks to multiple bandwidths, orthogonal frequency division multiplexing technology, and direct sequence spread spectrum and complementary code keying compatibility, Hi3861V100 is fully compliant with IEEE 802.11. Its powerful microprocessor, security, and interface versatility complement its running on HUAWEI LiteOS with third-party components for open and intuitive development and debugging.

RF and anti-interference

Mesh networking and comprehensive security

Multiple ecosystems and one-touch network access

Key Features

  • General Specifications

    • 1x1 2.4 GHz frequency band (channels 1–14)
    • PHY supporting IEEE 802.11b/g/n MAC supporting IEEE802.11 d/e/h/i/k/v/w
    • Built-in PA and LNA, integrated with TX/RX switch and balun
    • Station (STA) and access point (AP) modes, up to six STA devices allowed for access as an AP
    • WFA WPA, WFA WPA2 personal, and WPS2.0
    • 2/3/4-line PTA solution with BT and BLE chips coexisting
    • Input voltage range: 2.3–3.6 V
    • I/O power voltage: 1.8 V or 3.3 V
    • RF auto-calibration solution
    • Low power consumption: Tested at the ambient temperature of 25°C:  Ultra deep sleep mode: 3 μA@3.3 V Tested in a shielded environment at the ambient temperature of 25°C, with the RX duration of 1 ms, and powered by the buck:
    • DTIM1: 1.27 mA@3.6 V
    • DTIM3: 0.523 mA@3.6 V
    • DTIM10: 0.233 mA@3.6 V
  • PHY Features

    • All single-antenna data rates of IEEE802.11b/g/n
    • Maximum rate of 72.2 Mbit/s@HT20 MCS7
    • Standard 20 MHz bandwidth and 5 MHz/10 MHz narrow bandwidth
    • STBC RX
    • Short GI
  • MAC Features

    • A-MPDU and A-MSDU
    • Blk-ACK
    • QoS
  • CPU Subsystem

    • High-performance 32-bit microprocessor with a maximum operating frequency of 160 MHz
    • Built-in 352 KB SRAM and 288 KB ROM
    • Built-in 2 MB flash memory
  • Peripheral Interface

    • One SDIO interface, two SPI interfaces, two I2C interfaces, three UART interfaces, 15 GPIO interfaces, seven ADC inputs, six PWM interfaces, and one I2S interface (Note: The preceding interfaces are multiplexed.)
    • External primary crystal frequency of 40 MHz or 24 MHz
  • Other Information

    • Package: QFN-32, 5 mm x 5 mm
    • Operating temperature: –40°C to +85°C (–40°F to 185°F)

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