This smart camera SoC for action cameras, panoramic cameras, and rearview mirror cameras, supports H.265/H.264 encoding and decoding for 4K x 2K@60 fps and 1080p@240 fps performance. Integrated with HiSilicon's fourth-generation ISP, Hi3519AV100 delivers professional-quality images thanks to WDR, multi-level NR, and multiple image algorithms. Its advanced 12 nm low-power process and architecture simplify the heat dissipation design and save energy.

2-channel and 4-channel panoramic video stitching

6DoF digital image stabilization

NNIE with 2 TOPS of computing power

Key Features

  • Processor Core

    • Dual-core ARM Cortex-A53@1.5 GHz, 32 KB Icache, 32 KB D-cache or 256 KB L2-cache
    • Neon acceleration and integrated FPU
  • DSP

    • Integrated Tensilica Vision P6 DSP@710 MHz
    • 32 KB I-cache, 32 KB I-RAM, and 512 KB D-RAM
    • 0.3 TOPS neural network computing performance
    • HUAWEI LiteOS
  • NNIE

    • Multiple neural network options, such as AlexNet, VGG, ResNet, and GoogLeNet
    • Multiple neural network options for target detection, such as the Faster R-CNN, SSD, and YOLOv2
    • 1.7 TOPS neural network computing performance
    • Complete APIs and tool chains (compilers and simulators) to adapt to customized networks
  • Video Encoding and Decoding

    • H.265 main profile, level 5.1
    • H.264 baseline/main/high profile, level 5.1
    • I-/P-/B-slice supported for H.264/H.265 encoding and decoding
    • Baseline JPEG
    • Maximum resolution for H.264/H.265 encoding and decoding: 8192 x 8192
    • H.265/H.264 encoding and decoding performance:
    − 3840 x 2160@60 fps+720p@30 fps encoding
    − 3840 x 2160@60 fps decoding
    − 3840 x 2160@30 fps encoding+3840 x 2160@30 fps decoding
    • Maximum resolution for JPEG encoding and decoding: 8192 x 8192
    • Maximum JPEG encoding and decoding performance: 16 MP (4608 x 3456)@30 fps
    • Multiple bit rate control modes, such as CBR, VBR, AVBR, FixQp, and QpMap
    • Up to a bit rate of 120 Mbit/s for H.265 encoding outputs and 200 Mbit/s for H.264 encoding outputs
    • Encoding of up to eight ROIs
  • VI Interface

    • 12-lane image sensor serial inputs, as well as MIPI, sub-LVDS, HiSPi, and SLVS-EC interfaces
    • Up to 5-channel sensor serial inputs and multiple combination modes: 12-lane, 8- lane+4-lane, or 4-lane+4 x 2-lane
    • Maximum input resolution: 7680 x 8192
    • 10-/12-/14-bit Bayer RGB DC timing VI
    • BT.656 and BT.1120 VI 1–channel to 4-channel YUV inputs through the MIPI virtual channels
  • ISP and Image Processing

    • Multi-channel TDM to process multi-sensor video inputs
    • Adjustable 3A functions (AE, AWB, and AF)
    • FPN removal
    • 2-frame WDR exposure, local tone mapping, strong light suppression, and backlight compensation
    • Defect pixel correction and lens shading correction
    • Multi-level 3DNR, which removes motion smearing and chroma noise and provides excellent image effects in low illumination
    • 3D-LUT color adjustment
    • Image dynamic contrast enhancement and edge enhancement
    • CAC and purple fringe removal
    • Dehaze
    • 6DoF DIS and rolling shutter correction
    • LGDC and fisheye correction
    • Image rotation by 90° or 270°
    • Image mirroring and flipping
    • Multi-channel 1/15.5x–16x scaling outputs
    • OSD overlaying of up to eight regions before encoding
    • ISP adjustment tool on the PC
    • Maximum processing resolution: 7680 x 8192
  • 2D Graphics Processing

    • BitBlt operation
    • Line drawing
    • Alpha blending
    • Color key
    • CSC
  • Hardware Accelerated Engine for Video Stitching

    • 2-channel and 4-channel AVS
    • Stitching performance:
    − 2-channel 3000 x 3000@30 fps VI and 3840 x 2160@30 fps VO
    − 4-channel 1080 x 1920@30 fps VI and 3840 x 2160@30 fps VO
  • VO Interface

    • HDMI 2.0, supporting up to 4K x 2K (4096 x 2160)@60 fps outputs
    • 4-lane MIPI DSI, supporting up to 1080p@60 fps outputs
    • 6-/8-/16-/24-bit digital LCD/BT.656/BT.1120 interface, supporting up to 1080p@60 fps RGB/YUV outputs
    • Two independent HD VO channels (DHD 0 and DHD 1):
    − Any two interfaces can be used for the display of different sources.
    − DHD 0 supports 36-picture split display.
    − DHD 1 supports 16-picture split display.
    • One PIP layer, which can be overlaid with DHD 0 or DHD 1
    • Two full-screen GUI graphics layers in ARGB1555 or ARGB8888 format for DHD 0 and DHD 1
    • One hardware cursor layer in ARGB1555 or ARGB8888 format (configurable), supporting a maximum resolution of 256 x 256
    • One scaling WBC channel
  • CV Hardware Accelerated Engine

    • Hardware acceleration for binocular depth map computing, supporting the processing performance up to 720p@30 fps
    • Hardware acceleration for IVE 2.1 intelligent operators for feature point detection, opticalflow, and computer morphology processing, and so on
  • Audio Interface

    • Integrated audio codec, supporting 16-bit audio inputs and outputs
    • Dual-channel differential MIC inputs for reducing the background noise
    • I 2S interface for 8-channel audio TDM inputs and dual-channel audio outputs (mutually exclusive with the built-in audio codec)
    • HDMI audio output
  • Audio Encoding and Decoding

    • Voice encoding and decoding complying with multiple protocols by software
    • Audio encoding in formats such as G.711, G.726, and AAC
    • VQE
  • Network Interface

    • One GE interface:
    − RGMII and RMII modes
    − 10/100 Mbit/s half-duplex or full-duplex
    − 1000 Mbit/s full-duplex
    − TSO for reducing the CPU usage
  • Security Engine

    • AES, DES, and 3DES algorithms implemented by using hardware
    • RSA1024/2048/3072/4096 signature verification algorithm implemented by using hardware
    • HASH-SHA1/224/256/384/512 and HMAC_SHA1/224/256/384/512 tamper proofing algorithms implemented by using hardware
    • Integrated 32-kbit OTP storage space and hardware random number generator
    • Secure boot
    • Memory and I/O security isolation
  • Peripheral Interface

    • Two SDIO 3.0 interfaces:
    − SDIO 0 supports the SDXC card.
    − SDIO 1 supports the WiFi module.
    • One USB 3.0/PCIe 2.0 multiplexing port
    − USB 3.0 only or PCIe 2.0 X1+USB 2.0.
    − RC and endpoint supported as the PCIe 2.0 interface
    − Configurable USB host/device mode as the USB 3.0 interface
    • One USB 2.0 port, supporting configurable host/device mode
    • Internal POR signal output and external reset input
    • Independent battery for the built-in RTC
    • Integrated 4-channel LSADC
    • Nine UART interfaces (Some pins are multiplexed with other pins.)
    • Multiple I2C, SPI, and GPIO interfaces
    • One IR interface
    • Eight PWM interfaces (Some pins are multiplexed with other pins.)
  • External Memory Interface

    • 32-bit DDR4/LPDDR4 SDRAM interface
    − Maximum frequency of 1333 MHz for the DDR4/LPDDR4 SDRAM
    − Maximum DDR address space of 3.5 GB
    • SPI NOR flash interface
    − 1-/2-/4-line mode
    − 3-/4-byte address mode
    − Maximum capacity of 256 MB
    • SPI NAND flash interface
    − SLC flash
    − 2 KB/4 KB page size
    − 8-/24-bit ECC (unit: KB)
    − Maximum capacity of 1 GB
    • NAND flash interface
    − 8-bit data width
    − SLC flash
    − 2 KB/4 KB page size
    − 8-/16-/24-bit ECC (unit: KB)
    − Maximum capacity of 1 GB
    • eMMC 5.1 interface
    − HS400
    − Maximum capacity of 2 TB
    Configurable Boot Modes
    • Booting from the BOOTROM
    • Booting from the SPI NOR flash
    • Booting from the SPI NAND flash
    • Booting from the NAND flash
    • Booting from an eMMC Multiple Image Burning Modes
    • Image burning through UART 0
    • Image burning through an SD card
    • Image burning through a USB device
  • SDK

    • Linux SMP
    • High-performance H.265 iOS/Android decoding library
  • Physical Specifications

    • Power consumption
    − 2.2 W power consumption in typical scenarios for 4K x 2K (3840 x 2160)@30 fps encoding + deep learning intelligent algorithm
    − Multi-level power saving mode
    • Operating voltages
    − 0.8 V core voltage
    − 1.8 V or 3.3 V I/O voltage
    − 1.2 V DDR4 SDRAM interface voltage
    − 1.1 V LPDDR4 SDRAM interface voltage
    • Package
    − RoHS-compliant FCCSP
    − Body size: 15 mm x 15 mm (0.59 in. x 0.59 in.)
    − Lead pitch: 0.65 mm and 0.4 mm hybrid pitch
    − Operating temperature: 0°C–70°C

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