Chipsets

Hi3559AV100

Made to complement professional 8K ultra-HD mobile cameras, this SoC records 8Kp30/4Kp120 video with broadcast quality. It has multiple sensor inputs and both H.265 encoding and movie-level raw data outputs. Thanks to a high-performance ISP and advanced low-power process and architecture design, Hi3559AV100 is capable of excellent image processing.

Eight sensor inputs

HDMI 2.0 output

Quad-core DSP and dual-core NNIE with 4 TOPS of computing power

Key Features

  • Processor Core

    • Dual-core ARM Cortex A73@1.6 GHz, 32 KB I cache, 64 KB D cache or 512 KB L2 cache
    • Dual-core ARM Cortex A53@1.2 GHz, 32 KB I cache, 32 KB D cache or 256 KB L2 cache
    • Single-core ARM Cortex A53@1 GHz, 32 KB I cache, 32 KB D cache or 128 KB L2 cache
    • Neon acceleration and integrated FPU
  • GPU

    • Dual-core ARM Mali G71@900 MHz, 256 KB cache
    • OpenCL 1.1/1.2/2.0
    • OpenGL ES 3.0/3.1/3.2
  • Sensor Hub

    • Integrated ARM Cortex M7@192 MHz
    • Integrated PMC, which supports only external reset
    • Internal POR
    • General peripheral IPs (UART, SPI, I2C, PWM, GPIO, and LSADC)
    • 2-channel LSADC, seven UART interfaces, and eight PWM interfaces
  • Video Encoding

    • H.264 BP/MP/HP
    • H.265 Main Profile/Main 10 Profile
    • I/P/B frame supported in H.264/H.265 encoding mode
    • MJPEG/JPEG Baseline
    • A maximum of 8192 x 8640 resolution for H.264 encoding
    • A maximum of 16384 x 8640 resolution for H.265 encoding
    • Real-time multi-stream H.264/H.265 encoding capability:
    − 7680 x 4320@30 fps+1080p@30 fps+7680 x 4320@2 fps snapshot
    • Maximum JPEG snapshot performance of 7680 x 4320@15 fps
    • CBR, VBR, AVBR, FIXQP, and QPMAP bit rate control modes
    • Maximum 200 Mbit/s output bit rate
    • Encoding of eight ROIs
  • Video Decoding

    • H.264 BP/MP/HP
    • H.265 Main Profile/Main 10 Profile
    • JPEG/MJPEG Baseline
    • Maximum video decoding performance of H.264/H.265 7680 x 4320@30 fps or H.264/H.265 3840 x 2160@120 fps
    • Maximum 7680 x 4320@15 fps JPEG decoding
  • Intelligent Video Processing

    • Visual computing processing capability
    • Quad-core DSP@700 MHz, 32 KB I cache, 32 KB IRAM, or 512 KB DRAM
    • Dual-core NNIE@840 MHz neural network acceleration engine
    • 4.0 TOPS computing performance
    • Internal dual-sensor depth detection unit
  • Video and Graphics Processing

    • Anti-flicker for output videos and graphics
    • 1/15.5x to 16x video scaling
    • 360°or 720°panoramic stitching of up to 6- channel videos
    • 1/15.5x to 16x graphics scaling
    • OSD overlaying of eight regions before encoding
    • Video graphics overlaying of two layers (video layer and graphics layer)
  • ISP

    • 2-channel independent ISP processing of video inputs from multiple sensors in TDM mode
    • Adjustable 3A (AE, AWB, and AF) functions
    • FPN removal
    • Highlight suppression, backlight compensation, gamma correction, and color enhancement
    • DPC, NR, and 6-DOF DIS
    • 3DNR, image enhancement, and DCI
    • Anti-fog
    • LDC and fisheye correction
    • Picture rotation by 90° or 270°
    • Picture mirror and flip
    • HDR10
    • BT.2020 WCG
    • Sensor built-in WDR, 4F/3F/2F framebased/line-based WDR and local tone mapping
    • ISP tuning tools for the PC
  • Audio Encoding and Decoding

    • Voice encoding/decoding complying with multiple protocols by using software
    • G.711, G.726, AAC, and other audio encoding formats
    • Audio 3A (AEC, ANR, and ALC) functions
  • Security Engine

    • AES, DES, and 3DES encryption and decryption algorithms implemented by using hardware
    • RSA1024/2048/3072/4096 signature verification algorithm implemented by using hardware
    • HASH-SHA1/224/256/384/512 and HMAC_SHA1/224/256/384/512 tamper proofing algorithms implemented by using hardware
    • Integrated 32-kbit OTP storage space and hardware random number generator
  • Video Interfaces

    • VI interfaces
    − Eight sensor inputs
    − Maximum 32-megapixel (7680 x 4320) or 36-megapixel (6000 x 6000) resolution
    − 8-/10-/12-/14-bit RGB Bayer DC timing VI, up to 150 MHz clock frequency
    − BT.601, BT.656, and BT.1120 VI interfaces
    − Maximum 16-lane MIPI/LVDS/subLVDS/HiSPi/SLVS-EC interface for the serial sensor inputs
    − Maximum 8-channel video inputs for the serial sensor inputs, supporting various working modes such as 1x16-lane/2x8- lane/4x4-lane/2x4-lane+4x2-lane/8x2Lane
    − Compatibility with the electrical specifications of parallel and differential interfaces of various sensors
    − Programmable sensor clock output
    • VO interfaces
    − HDMI 2.0 display output
    − Up to 8K (7680 x 4320)@30 fps HDMI resolution
    − 6-/8-/16-/24-bit RGB digital LCD output, supporting maximum 1920 x 1080@60 fps output
    − 4-lane MIPI DSI output, supporting maximum 2.5 Gbit/s per lane frequency
  • Audio Interfaces

    • Integrated audio codec, supporting 16-bit audio inputs and outputs
    • I 2S interface for connecting to the external audio codec
    • Dual-channel differential MIC inputs for reducing background noises
  • Peripheral Interfaces

    • POR
    • External reset input
    • Internal RTC
    • Integrated 2-channel LSADC
    • Five UART interfaces
    • IR interface, I2C interface, SSP main interface, and GPIO interface
    • Integrated two GMACs, supporting RGMII/RMII
    • Two PWM interfaces
    • Two SD 3.0/SDIO 3.0 interfaces and an SD 2.0 interface
    • Two USB 3.0/USB 2.0 host/device ports
    • 2-lane PCIe 2.0 RC/EP mode
  • External Memory Interfaces

    • DDR4/LPDDR4 interface
    − 64-bit DDR4
    − 2x 32-bit LPDDR4 SDRAMs
    − Maximum capacity of 8 GB
    • SPI NOR flash interface
    − 1-/2-/4-line mode
    − 3-byte or 4-byte address mode
    − Maximum capacity of 64 MB
    • SPI NAND flash interface
    − Maximum capacity of 512 MB
    • NAND flash interface
    − 8-bit data width
    − SLC or MLC
    − 4-/8-/16-/24-/40-/64-bit ECC
    • eMMC 5.1 interface
    − Maximum capacity of 2 TB
    • UFS 2.1 interface
    − Maximum capacity of 512 GB
    • Booting from the SPI NOR flash, SPI NAND flash, or NAND flash
    • Booting from an eMMC or UFS
  • SDK

    • Linux SMP
    • Linux+HUAWEI LiteOS dual-system AMP
    • High-performance H.265 decoding library
  • Physical Specifications

    • Power Consumption
    − Typical power consumption of 3 W in 4K120 encoding mode
    − Multi-level power saving modes
    • Operating voltages
    − 0.8 V core voltage
    − 1.8 V I/O voltage
    − 1.2 V DDR4 SDRAM interface voltage
    − 1.1 V LPDDR4 SDRAM interface voltage
    • Package
    − RoHS, FC-BGA
    − Body size of 25 mm x 25 mm (0.98 in. x 0.98 in.)
    − Lead pitch of 0.65 mm (0.03 in.)

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