Chipsets

Hi3516EV200

This new-generation SoC camera uses advanced low-power technology and architecture design for HD industry applications. Now enjoy a low bit rate, power consumption, and EBOM costs, without compromising picture quality. Hi3516EV200 has an interface similar to HiSilicon DVR and NVR SoCs for rapid mass production.

New-generation ISP

Brand-new H.265 video compression encoder with low bit rate and high image quality

POR, RTC, and audio codec

Key Features

  • Processor Core

    • ARM Cortex-A7@ 900 MHz, 32KB I-Cache, 32KB D-Cache /128KB L2 cache
    • NEON acceleration and the integrated floating-point processing unit (FPU)
  • Video Encoding

    • H.264 BP/MP/HP, supporting I-/P- frames
    • H.265 MP, supporting I-/P- frames
    • MJPEG/JPEG baseline encoding
  • Video Encoding Performance

    • Maximum resolution for H.264 /H.265 encoding: 2304 x 1296 (with the width up to 2304)
    • Real-time multi-stream H.264/H.265 encoding capability:
    − 2048 x 1536@20 fps + 720 x 576@20 fps
    − 2304 x 1296@20 fps + 720 x 576@20 fps
    − 1920 x 1080@30 fps + 720 x 576@30 fps
    • JPEG snapshot at 3M (2304 x 1296)@5 fps
    • CBR, VBR, FIXQP, AVBR, QPMAP and CVBR bit rate control modes
    • Intelligent encoding mode
    • Up to 60 Mbit/s output bit rate
    • Encoding of eight ROIs
  • Intelligent Video Analysis

    • IVE
    • Various intelligent analysis applications, such as intelligent motion detection, perimeter defense, and video diagnosis
  • Video and Graphics Processing

    • 3DNR, image enhancement, and DCI
    • Anti-flicker for output videos and graphics
    • 1/15x to 16x video and graphics scaling
    • Overlaying of videos and graphics
    • Image rotation by 90°, 180°, or 270°
    • Image mirror and flip
    • OSD overlaying of eight regions before encoding
  • ISP

    • 4 x 4 pattern RGB-IR sensor
    • 3A (AE, AF, and AWB) function. The thirdparty 3A algorithms are supported.
    • FPN removal and DPC
    • LSC, LDC, and purple edge correction
    • Direction-adaptive demosaic
    • Gamma correction, DCI, and color management and enhancement
    • Adaptive region de-fog
    • Multi-level NR (BayerNR and 3DNR) and sharpening enhancement
    • Local tone mapping
    • Sensor built-in WDR
    • 2F-WDR frame-based mode
    • DIS
    • Intelligent ISP tuning and ISP tuning tools for the PC
  • Audio Encoding and Decoding

    • Voice encoding/decoding complying with multiple protocols by using software
    • Compliance with the G.711, G.726, and ADPCM protocols
    • Audio 3A functions (AEC, ANR, and AGC)
  • Security Engine

    • AES/RSA encryption and decryption algorithms implemented by using hardware
    • HASH (SHA1/SHA256/HMAC_SHA1/HMAC_SHA256) algorithms implemented by using hardware
    • Integrated 32-kbit OTP storage space and random number generator
  • Video Interfaces

    • Input
    − 8-/10-/12-bit RGB Bayer DC timing VI
    − MIPI, LVDS/sub-LVDS, and HiSPi
    − Compatibility with mainstream HD CMOS sensors provided by Sony, ON, OmniVision, and Panasonic
    − Compatibility with the electrical specifications of parallel and differential interfaces of various sensors
    − Programmable sensor clock output
    − Maximum input resolution: 2304 x 1296
    • Output
    − 6-/8-bit LCD output
    − BT.656/BT.1120 output
  • Audio Interfaces

    • Integrated audio codec, supporting 16-bit audio input and output
    • Mono MIC/line-in input
    • Mono line-out output
    • I2S interface for connecting to external audio codec
  • Peripheral Interfaces

    • POR
    • Integrated high-precision RTC
    • Integrated 2-channel LSADC
    • Three UART interfaces
    • I 2C, SPI, and GPIO interfaces
    • Four PWM interfaces
    • One SDIO 2.0 interface and one SD 2.0 card
    • One USB 2.0 host/device port
    • Integrate FE PHY. TSO network acceleration is supported.
  • External Memory Interfaces

    • SDRAM interface
    − Built-in 512 Mb DDR2
    • SPI NOR flash interface
    − 1-/2-/4-line mode
    − Maximum capacity: 256 MB
    • SPI NAND flash interface
    − 1-/2-/4-line mode
    − Maximum capacity: 1 GB
    • eMMC 4.5 interface
    − 4-bit data width
  • Boot

    • Booting from the SPI NOR flash memory, SPI NAND flash memory, or eMMC
    • Secure boot
  • SDK

    • HUAWEI LiteOS/Linux-4.9-based SDK
    • High-performance H.264 PC decoding library
    • High-performance H.265 PC, Android, and iOS decoding libraries
  • Physical Specifications

    • Power consumption
    − Typical power consumption in the 1080P30/3M20 scenario: 700 mW
    • Operating voltages
    − 0.9 V core voltage
    − 3.3 V I/O voltage (±10%)
    − 1.8 V SDRAM interface voltage
    • Packaging
    − 9 mm x 9 mm, 88 pins, 0.35 mm ball pitch, QFN package

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